Nimbus Technologies

PAC & Local I/O Modules

Leading Manufacturers, Exporters, Wholesaler, Retailer of XW I/O Expansion Board, XV I/O Expansion Board, X I/O Expansion Board, I-9K & I-97K Series Remote I/O Module and I-8000 Series PAC and View PAC I/O Module from Thane.

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XW-Board is a  I/O expansion board inserted uPAC-5000, LP-51xx, and WP-51xx with Modbus protocol for expanding I/O functions. The XW-Board allows users to implement various I/O functions such as DI, DO,AI,AO, Timer/Counter, Serial Communication  I/O functions.

This manual assumes that the user has some knowledge of commissioning and programming of Modbus devices, including some knowledge of the Modbus protocol and your controller unit.

 

One PAC can only plug only one XW-board.The XW-board series have following common specification:

  • DI channel is dry contact, sink type.
  • DO channel is open collector, sink type.
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Business Type Exporter, Supplier, Retailer, Wholesaler
Voltage 220V
Operating Temperature -25 +85deg C
Frequency 50Hz, 60Hz
Driven Type Electric
Features Auto Controller, Durable, High Performance
Warranty 2Years
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Business Type Exporter, Supplier, Retailer, Wholesaler
Color Green
Voltage 220V
Power Type AC, DC
Operating Temperature -25 +85deg C
Frequency 50Hz, 60Hz
Driven Type Electric
Warranty 2Years
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Following μPAC supports I/O Expansion Bus, can mount one X-Board

  • For C language solution: I-7188XB(D), I-7188EX(D), μPAC-7186EX(D), μPAC-7186PEX(D),μPAC-7186EX(D)-FD, μPAC-7186EX(D)-SM
  • For ISaGRAF solution: I-7188XG(D), μPAC-7186EG(D)

 

X-Board is Series has following common specifications

  • DI channel: Dry contact, sink type, non-isolated
  • DO channel: Open Collector, sink type, 100 mA/channel load current, non-isolated
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I-9K and I-97K series modules are provided for combining a variety of I/O functions within the WP-9000, XP-9000, LX-9000 and LP-9000 programmable automation controllers (PAC). The I-9K series is based on a parallel interface with high communication speed; while the I-97K series is based on a serial interface.

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There are two types of I/O communication bus, parallelbus and serial bus. The parallel bus type I/O modules (highprofile I-8K series) are high speed ones used only in thePACs including XPAC, WinPAC, iPAC, ViewPAC, etc. And theserial bus type I/O modules (high profile I-87K series) arelow speed ones used in both PACs including XPAC, WinPAC,iPAC, ViewPAC, etc., and I/O expansion units including RU-87Pn, ET-87Pn, USB-87Pn, etc.

 

Parallel I/O Modules (I-8KW Series) Includes

  • High speed A/D: 100 k samples/second
  • High speed D/A: 30 k (-10 ~ +10 V)
  • High speed DI & DO: All Digital I/O modules provide visual
  • indication of status via LED indicators
  • High speed stepping/Servo motion control modules
  • High speed encoder modules
  • High performance Counter/Frequency modules
  • High speed multi-channel RS-232/422/485 modules
  • CAN bus communication modules
  • FRnet communication modules

 

Serial I/O modules (I-87KW Series) Includes

  • RTD Input modules
  • Thermocouple Input modules
  • Strain Gauge Input modules
  • VW Input modules
  • High resolution multi-channel Analog Input modules
  • Isolated multi-channel D/A modules
  • Digital Input and Digital Output modules with Latch and
  • counter function
  • Counter/Frequency modules

 

With a range of standard communication interfaces and a dualbackplane bus permitting I/O expansion.The dual backplane bus is hybrid in nature providing the facility toconnect either serial or parallel I/O modules. 

 

The parallel bus isused for high speed data transfer.The unit can communicate using serial communications (RS-232, RS-485), Ethernet, or CAN bus. The Ethernet version of theproduct supports an integrated web server permitting Internet andIntranet applications.

 

With different communication interface, the I/O modules can be classified to high communication speed (Parallel bus) 8K series modules and low communication speed (serial interface) 87K series modules.

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